TESTWORK VARIABILITY – IMPLICATIONS FOR GRINDING CIRCUIT DESIGN

T.Vizcarra, B. Wong

Presented at SAG Conference Vancouver, Canada September 22 – 26, 2019

ABSTRACT

JKTech has completed a comparative testing program of Bond tests as an addition to its “round-robin” quality control program for JK Drop Weight(JKDW)and SMC tests. Over seventy Bond tests of representative splits of quarry material were undertaken by over thirty participating laboratories. To JKTech's knowledge, this represents the largest comparative study of Bond testing reported in the literature.

The scale of the exercise meant that the variability due to systematic differences between laboratories, as well as the inherent experimental error of the test, could be decoupled. These “errors” in the Bond test are often under-appreciated in design, and the results are discussedin the context of implications for mill sizing. Other major factors that drive ball milling efficiency, which are not accounted for by the Bond equation but are strongly evident in the JKTech database, are also presented.

Keywords

Design risk, Bond test, variability

AUTHORS

*Tim G. Vizcarra (1) & Bevin Wong(1)

1 JKTech Pty Ltd, 40 Isles Road, Indooroopilly, QLD, Australia, 4068

(*Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.)

Acknowledgements

The authors wish to thank JKTech for permission to publish this paper. Prof.Tim Napier-Munn and Greg Lane are gratefully acknowledged for useful comments and feedback in the preparation of this manuscript

Categories

0